CVE-2022-25697

CVSS V2 None CVSS V3 None
Description
Memory corruption in i2c buses due to improper input validation while reading address configuration from i2c driver in Snapdragon Mobile, Snapdragon Wearables
Overview
  • CVE ID
  • CVE-2022-25697
  • Assigner
  • product-security@qualcomm.com
  • Vulnerability Status
  • Analyzed
  • Published Version
  • 2022-12-13T16:15:18
  • Last Modified Date
  • 2023-04-19T17:10:55
Weakness Enumerations
CWE URL
CWE-20 http://cwe.mitre.org/data/definitions/20.html
CPE Configuration (Product)
CPE Vulnerable Operator Version Start Version End
AND
cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:sd_8_gen1_5g:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:sd429_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:sd429:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:sda429w_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:sda429w:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:sdm429w:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcd9380:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcn3610_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcn3610:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcn3620_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcn3620:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcn3660b_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcn3660b:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcn3680b_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcn3680b:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcn3980:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcn6855:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcn6856:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcn7850:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wcn7851:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wsa8830:-:*:*:*:*:*:*:* 0 OR
AND
cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:* 1 OR
cpe:2.3:h:qualcomm:wsa8835:-:*:*:*:*:*:*:* 0 OR
References
Reference URL Reference Tags
https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin
Sources
Source Name Source URL
NIST https://nvd.nist.gov/vuln/detail/CVE-2022-25697
MITRE https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2022-25697
History
Created Old Value New Value Data Type Notes
2022-12-13 16:18:28 Added to TrackCVE
2022-12-13 17:21:44 2022-12-13T16:15:18.490 2022-12-13T16:15:18 CVE Published Date updated
2022-12-13 17:21:44 2022-12-13T17:15:14 CVE Modified Date updated
2022-12-13 17:21:44 Received Awaiting Analysis Vulnerability Status updated
2022-12-13 17:21:44 Memory corruption in i2c buses due to improper input validation while reading address configuration from i2c driver in Snapdragon Mobile, Snapdragon Wearables Memory corruption in i2c buses due to improper input validation while reading address configuration from i2c driver in Snapdragon Mobile, Snapdragon Wearables Description updated
2022-12-14 16:16:02 Awaiting Analysis Undergoing Analysis Vulnerability Status updated
2022-12-15 17:15:19 2022-12-15T16:47:18 CVE Modified Date updated
2022-12-15 17:15:19 Undergoing Analysis Analyzed Vulnerability Status updated
2022-12-15 17:15:19 CWE-20 Weakness Enumeration new
2022-12-15 17:15:20 CPE Information updated
2023-04-19 18:03:31 2023-04-19T17:10:55 CVE Modified Date updated