CVE-2017-18157

CVSS V2 High 7.2 CVSS V3 High 7.8

Description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Overview

CVE ID
CVE-2017-18157

Assigner
product-security@qualcomm.com

Vulnerability Status
Analyzed

Published Version
2019-05-06T23:29:00

Last Modified Date
2019-05-07T15:58:11

Weakness Enumerations

CWE	URL
CWE-416	http://cwe.mitre.org/data/definitions/416.html

CPE Configuration (Product)

CPE	Vulnerable	Operator
		AND
cpe:2.3:o:qualcomm:mdm9206_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:mdm9206:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:mdm9607_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:mdm9607:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:mdm9650_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:mdm9650:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:msm8909w_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:msm8909w:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:msm8996au_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:msm8996au:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_210_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_210:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_212_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_212:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_205_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_205:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_425_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_425:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_450_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_450:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_615_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_615:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_616_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_616:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_415_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_415:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_625_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_625:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_650_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_650:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_652_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_652:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_820_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_820:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_820a_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_820a:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_835_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_835:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sd_845_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sd_845:-:::::::*	0	OR
		AND
cpe:2.3:o:qualcomm:sdx20_firmware:-:::::::*	1	OR
cpe:2.3:h:qualcomm:sdx20:-:::::::*	0	OR

CVSS Version 2

Version
2.0

Vector String
AV:L/AC:L/Au:N/C:C/I:C/A:C

Access Vector
LOCAL

Access Compatibility
LOW

Authentication
NONE

Confidentiality Impact
COMPLETE

Integrity Impact
COMPLETE

Availability Impact
COMPLETE

Base Score
7.2

Severity
HIGH

Exploitability Score
3.9

Impact Score
10

CVSS Version 3

Version
3.0

Vector String
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Attack Vector
LOCAL

Attack Compatibility
LOW

Privileges Required
LOW

User Interaction
NONE

Scope
UNCHANGED

Confidentiality Impact
HIGH

Availability Impact
HIGH

Base Score
7.8

Base Severity
HIGH

Exploitability Score
1.8

Impact Score
5.9

References

Reference URL	Reference Tags
https://www.qualcomm.com/company/product-security/bulletins	Vendor Advisory

Sources

Source Name	Source URL
NIST	https://nvd.nist.gov/vuln/detail/CVE-2017-18157
MITRE	https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2017-18157

History

Created	Old Value	New Value	Data Type	Notes
2022-05-10 07:53:31				Added to TrackCVE
2022-12-03 20:25:08	security.cna@qualcomm.com	product-security@qualcomm.com	CVE Assigner	updated
2022-12-03 20:25:08	2019-05-06T23:29Z	2019-05-06T23:29:00	CVE Published Date	updated
2022-12-03 20:25:08		2019-05-07T15:58:11	CVE Modified Date	updated
2022-12-03 20:25:08		Analyzed	Vulnerability Status	updated