CVE-2016-2063

CVSS V2 Medium 4.6 CVSS V3 High 7.8
Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Overview
  • CVE ID
  • CVE-2016-2063
  • Assigner
  • cve@mitre.org
  • Vulnerability Status
  • Analyzed
  • Published Version
  • 2016-08-07T21:59:04
  • Last Modified Date
  • 2020-08-06T18:24:18
CPE Configuration (Product)
CPE Vulnerable Operator Version Start Version End
cpe:2.3:o:linux:linux_kernel:*:*:*:*:*:*:*:* 1 OR 3.0 3.19.8
CVSS Version 2
  • Version
  • 2.0
  • Vector String
  • AV:L/AC:L/Au:N/C:P/I:P/A:P
  • Access Vector
  • LOCAL
  • Access Compatibility
  • LOW
  • Authentication
  • NONE
  • Confidentiality Impact
  • PARTIAL
  • Integrity Impact
  • PARTIAL
  • Availability Impact
  • PARTIAL
  • Base Score
  • 4.6
  • Severity
  • MEDIUM
  • Exploitability Score
  • 3.9
  • Impact Score
  • 6.4
CVSS Version 3
  • Version
  • 3.1
  • Vector String
  • CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
  • Attack Vector
  • LOCAL
  • Attack Compatibility
  • LOW
  • Privileges Required
  • LOW
  • User Interaction
  • NONE
  • Scope
  • UNCHANGED
  • Confidentiality Impact
  • HIGH
  • Availability Impact
  • HIGH
  • Base Score
  • 7.8
  • Base Severity
  • HIGH
  • Exploitability Score
  • 1.8
  • Impact Score
  • 5.9
History
Created Old Value New Value Data Type Notes
2022-05-10 17:25:15 Added to TrackCVE
2022-12-02 10:50:17 2016-08-07T21:59Z 2016-08-07T21:59:04 CVE Published Date updated
2022-12-02 10:50:18 2020-08-06T18:24:18 CVE Modified Date updated
2022-12-02 10:50:18 Analyzed Vulnerability Status updated